What i call the CML chip seems to be the key to properly controlling the IDM. IE, no hacks. In order to understand this chip better it was removed and an evaluation break out board was assembled to study various aspects of the chip. Points of interest are current usage, voltage thresholds and the theirassociated discriminations. Also timing points relative to power up, current sense and voltage sense will be studied.

I could have easily used one of those prefabricated SMT device converters but where is the fun in that? It is good to keep in practice anyway as money doesn't buy this kind of experience. I devatied a bit on this break out board. This time i tried out a method i aquired not long ago from a Japanese man. His method is to use the conductor side of the prototyping board, mask off the clads where the chip will be mounted and glue the chip to the masking area. Here is where i deviated, instead of using glue i used double side tape to hold the chip. I've found the glue to be hit and miss in terms of functionality. Anyway, the double sided tape worked out really well. Since the prototyping board is inverted the IDC connection pins exert opposite force on the clads. This in turn has the potential to break the clad free from the board. To solve this problem i simply cut down the plastic portion of an IDC connector and pressed it into place. This seems to work really well. Notice the terrible solder joints. This comes from a cold building(35 degrees f) it is that cold because i refuse to buy oil for heat. The cold and i don't mix, and my soldering station has the same opinion. Hence the terrible soldering job here.