If you have been with us from the start you know that we had initially suspected the use of a 68HC line of automotive microcontrollers. We had no way to prove this to be true other than remove the PLCC from the IDM PCB and then attempt to remove the silicon chip from the PLCC.

All the pins were cut from the PLCC notches were cut in each corner and stress fracture guides we cut to ease the cracking process. The PLCC was heated to approximately 500f and then a screw driver was used to break away most of the PLCC. The copper pad which supports the die was then exposed, the rest of the PLCC was removed with a small cutting wheel. After quite a while the silicon chip itself with minimal PLCC residue remained. A small hand file was used to remove the smaller portions then an exact knife was used to carefully remove the silicon binding agent.

Looking through a cheap microscope at 200x i found the part number of the die.

Though this image is not focused very well, at can be seen that this chip is in fact a 68HC line of microcontroller.